The performance of current quantum devices such as superconducting qubits, single photon emitters, and quantum sensors is limited in part by losses at surfaces and interfaces. Conventional fabrication using dry etch processes disorders and contaminates surfaces and sidewalls, increasing device loss. We are developing novel atomic layer etch (ALE) processes with reduced interfacial damage. In this talk, we will describe how quantum devices are made, evidence of interfacial loss, the mechanisms and chemistry of ALE, and how ALE is already being used to improve quantum device performance. 

Russ Renzas is an expert in atomic scale processing and superconducting device fabrication. He joined UNR in 2024, where he successfully setup the premier multiuser microfabrication facility in Nevada as both facility director and faculty in Electrical Engineering. Prior to UNR, Professor Renzas was the Quantum Technology Manager at Oxford Instruments Plasma Technology. He was at Rigetti Computing from 2016-2018, where he setup Fab-1 and led teams which delivered Rigetti’s first publicly-available quantum processors, increased T1 by 5x, automated Josephson Junction and via testing, and increased superconducting via yield from 0% to 99%. Professor Renzas earned his Ph.D. in Physical Chemistry at UC Berkeley (2010) and his B.S.E. in Electrical Engineering at Princeton University (2005).  He has over 20 academic publications with > 4,000 citations and 3 patents, and has given over 50 seminars on atomic scale processing for quantum device fabrication. His most recent publication represents the first research ever conducted at UNR’s new fabrication facility.