Date: Tuesday, June 15, 2021
Time: 1:00 p.m.-5:00 p.m. EDT
Different FIB source technologies will be introduced. The basics of ion-solid interaction theory will be discussed, including use of ions for different applications and understanding ion implantation damage and how to mitigate it. The expanding applications of plasma FIB instruments compared to traditional Ga+ ion FIBs will be emphasized.  Ion patterning and delayering of semiconductor devices will be presented, and the use of FIBs for nano- and micro- prototyping, including applications for mechanical testing will be presented.  Large area 2D sectioning and 3D FIB-SEM tomography will be covered. FIB methods for S/TEM and APT specimen preparation will be discussed in detail.

Webinar Objectives/Topics

  • Comparison of Ion Sources for FIB Instruments
  • Ion-Solid Interactions, Ion Imaging, Ion Implantation Damage
  • 2D Sectioning and 3D FIB SEM Tomography
  • Ion Patterning, Delayering, and FIB Milling for Micromechanical Testing
  • S/TEM and APT Specimen Preparation


Lucille A. Giannuzzi, Ph.D., FAVS, FMSA, FMAS

L.A. Giannuzzi & Associates LLC

Who Should Attend

This webinar is intended for students, scientists, engineers and technicians who use or plan to use FIB instruments.

Webinar Cost

  • $200 (AVS Platinum Member)
  • $250 (Non-Member or AVS Gold/Silver Member)
  • $50 (Full-time Student/Requires Student I.D.)

Platform: Zoom

Times listed are Eastern Daylight Time (EDT)Check your timezone accordingly!

Each webinar includes a link to a pdf file of the copyrighted webinar notes. During the webinar you may ask questions. Presenters will review and answer them periodically throughout the presentation. 

You must be present the day of the webinar, recorded versions will not be available.

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Questions about Membership: Contact Angela Klink, AVS Member Services Administrator, angela@avs.org for more details.

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