The semiconductor industry is headed towards heterogeneous integration in 2.5D or 3D form being driven primarily by the high cost of monolithic integration, extended time to market using advanced process nodes on large designs, and heterogeneity of systems. This is great news for packaging.
On the communication side emerging 5G mmWave frequencies are projected to support enormous bandwidth with 1-10Gps data speeds. Active research is ongoing to increase the data speeds even more by moving to higher frequencies in the sub-THz frequency range namely, 6G. With a broad range of frequencies to support, advanced packaging solutions are required.
This presentation addresses the needs for 5G and 6G communication along with the progress made on glass interposer-based solutions at Georgia Tech’s Packaging Research Center, which includes work being done in collaboration with Sandia. Advances in the application of machine learning for design optimization in the context of beamforming will be discussed as well.
Who Should Attend
Madhavan Swaminathan, John Pippin Chair in Microsystems Packaging & Electromagnetics, Director, 3D Systems Packaging Research Center (PRC); School of Electrical and Computer Engineering, School of Materials Science and Engineering (Joint Appt.); Georgia Tech (GT), USA www.prc.gatech.edu
Madhavan Swaminathan is the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC), Georgia Tech (GT) (http://www.prc.gatech.edu). He also serves as the Site Director for the NSF Center for Advanced Electronics through Machine Learning (CAEML: https://publish.illinois.edu/advancedelectronics/) and Theme Leader for Heterogeneous Integration, at the SRC JUMP ASCENT Center (https://ascent.nd.edu/). Prior to joining GT, he was with IBM working on packaging for supercomputers. He is the author of 550+ refereed technical publications and holds 31 patents. He is the primary author and co-editor of 3 books and 5 book chapters, founder and co-founder of two start-up companies, and founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. He received his MS and Ph.D degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.
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