Overview

Date: Wednesday, August 26, 2020
Time: 1:00 p.m.-5:00 p.m. EDT
Platform: Zoom
Cost:
Understanding the origin of stress in thin films produced by physical vapor deposition (PVD) is of key importance as excessive stress levels can lead to premature failure by cracking, buckling or interfacial delamination, which compromises device durability. This webinar will provide an overview on how film stress develops during deposition, how it is affected by the main process parameters, and how to mitigate it. Selected examples from epitaxial, amorphous and polycrystalline thin films will be highlighted, with emphasis on metallic thin films. Models explaining the generation and relaxation of stress will be presented and discussed.

Who Should Attend

This webinar is intended for researchers, students, technologists and others involved in the physical vapor deposition of thin films and looking to gain an understanding or broaden their knowledge on how intrinsic stress develops during thin film deposition, and how to mitigate it. The course will be beneficial to a large audience, from young scientists to engineers, as various aspects including basic concepts and modelling, instrumentation methods for measuring stress and strategies to control stress levels will be covered.

Save with AVS Membership

Save $50 per AVS Webinar with an AVS Platinum Membership. The savings from just two webinars is equivalent to the price of an AVS Platinum Membership, which provides discounts on conferences/short courses as well as access to the AVS publications and technical libraries, career services, and more. Don’t miss out on these savings. Contact Angela Klink, AVS Membership Administrator, angela@avs.org, for your discount code or to upgrade to Platinum.

Presenter

Gregory Abadias, Professor
Physics and Materials Science Department
Institut Pprime, Université de Poitiers Chasseneuil-Futuroscope, FR

Webinar Objectives

  • Learn the different stress sources in PVD thin films
  • Identify the links between growth stages and intrinsic stress evolution during polycrystalline film growth
  • Provide the basic concepts and underlying atomistic and microscopic mechanisms at the origin of stress generation and relaxation
  • Determination of residual stress by wafer curvature or depth-resolved techniques (XRD, FIB-DIC) and their limitations
  • Understand the influence of microstructure (grain size, texture) and main process parameters on the stress development
  • Understand the role of energetic species, involved during magnetron sputtering, HiPIMS or ion-beam assisted deposition, on defect incorporation and compressive stress build-up
  • Gain knowledge on stress manipulation strategies to control and engineer stress for specific applications

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